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A Low-Transmission-Loss Material to Expand the Possibilities for Next-Generation Telecommunications

Low-Transmission-Loss Material

Applicable Business Areas

Substrate manufacturers, automotive parts manufacturers, telecommunication equipment manufacturers, others

Target Applications

Telecommunication equipment/radar

As adoption of autonomous vehicle driving systems increases, advanced recognition technologies and risk prediction will be required before fully autonomous driving can be made possible. Improving the sensitivity of antennas to detect millimeter waves is a top priority. AS-400HS, a low-transmission-loss material, was recently developed by Hitachi Chemical. It boasts excellent dielectric and transmission properties in the high-frequency band. Generally, thermoplastic resin substrates, including fluorinated resins and liquid crystal polymers, have generally been used for high-speed telecommunication equipment. However, these materials have a problem: they require large, specialized equipment for drilling/laser processing. Our AS-400HS does not require processing due to its high adhesion to copper wire. In addition, its low transmission loss properties are superior to those of thermoplastic resin materials, enabling the creation of advanced substrates for next-generation, high-speed telecommunications.

Innovative Solution

Lower Impedance Compared to Conventional Insulating Substrates

AS-400HS features the low transmission loss (dielectric loss) and excellent dielectric properties compared to conventional thermoplastic resin substrates. It maintains excellent transmission properties in multilayered designs. In addition, its high adhesion to low-profile copper foil improves the conductivity of the wire circuit. These features make AS-400HS ideal for high-frequency, multilayer antennas with high-sensitivity requirements.

Multi-Layer, High-Frequency Circuits with No Need for Adhesive Layers

Multilayer, high-frequency circuits are essential to improve the processing speed. When conventional thermoplastic resin is used as the substrate material, adhesive layers are needed. AS-400HS, however, renders adhesive layers obsolete; this creates opportunities for material reduction, process simplification, and greater design flexibility.

Product Features

Excellent Transmission Properties in High-Frequency Bands

AS-400HS demonstrates excellent transmission properties by inhibiting both dielectric loss caused by resin, and conductivity loss caused by copper foil. It also ensures exceptional transmission properties in the millimeter wave band (≧30 GHz).

Superior Workability

Via cross section of a laser-processed material

Via cross section of a laser-processed material

AS-400HS supports drilling/laser processing similar to that of FR-4*. The common wet desmear process can be used for pre-plating, with no need for additional plasma processing. Further, a general wire circuit manufacturing process can be used because low temperature molding(-200℃) of AS-400HS is possible, unlike when using fluorinated resin. Our proprietary filler composition ensures an even resin layer after molding, reducing the in-plane unevenness of the dielectric constant.

*FR-4 stands for Flame Retardant Type 4. It is made by impregnating glass fiber with an epoxy resin, applying a thermosetting process, and forming it into a sheet. This material features both fire retardancy and low dielectric properties.

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